Seikoh Giken’s SFP-560A is a new, optimized polishing machine for MPO/MTP connectors, with which the pressure of the polishing plate is automatically adjusted. Two features that complement each other are crucial in this machine. The dynamic pressure control (DPC) automatically controls the pressure with which the polishing plate is moved up to the connectors. At the same time, the independent pressure control adjusts the individual contact pressure of each individual connector. Together, these two features guarantee uniform polishing.
The polishing machine distributed by LASER COMPONENTS is particularly suitable for the production of patch cables. Up to 24 MPO or single ferrule connectors can be polished simultaneously. For daily operation, up to 60 polishing processes can be pre-programmed and, if necessary, exchanged with other systems via the integrated USB interface.
The SFP-560A builds on the technology of its predecessor, the SFP-550. All polishing plates can still be used.